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Chapter 6 of 8Semiconductors1 min read · 1 exhibits

Regulatory and Policy Landscape

How do export controls and subsidies reshape the industry?

Chapter summary

Current controls target sub-14nm logic, 128-layer NAND and 18nm DRAM, with possible tightening to sub-10nm and advanced packaging. Subsidies redirect where fabs are built.

Key takeaways

  1. 1

    US subsidies of $52B span fabs, R&D and workforce.

  2. 2

    The European Chips Act mobilises €43B of public and private investment.

  3. 3

    Western equipment makers face $30–50B of lost revenue from China in 2023–2030.

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